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The PCB communication network applied to the RF Power Amplifier, which amplifies input signals in 5G wireless communication and transmits them to antennas, is responsible for the transmission and reception of radio waves such as 5G-related repeaters, RF, remote, CPU, etc.
This includes HIGH-SPEED PCBs with hybrid PCB (FR4 + LOW D/K) / LOW D/K (low Permittivity) applied.
This includes HIGH-SPEED PCBs with hybrid PCB (FR4 + LOW D/K) / LOW D/K (low Permittivity) applied.
※ Permittivity: The degree to which a substance can accumulate an electrical charge when an electric field is applied.
SPECIFICATION
- LAYER : 2L – 40L
- MATERIAL : FR-4, HYBRID (FR-4+LW D/K)
- COPPER : 0.3 ~ 2.0
- THICKNEES : 0.4 ~ 4.0
- SURFACE TREATMENT : ENIG, TIN, HASL, OSP
- OPTION :
- HPL,
- PULSE PLATING,
- BACK-DRILL,
- PLASMA,
- IMPEDANCE
